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91.07.22. -Left PT2,PT3,PT4,PT5 only and update their PCBFootPrint and library . (Modif y CKT,BOM and -Change Q60 from @2N7002 to 2N7002 . (Modify CK T&BOM) Layout) -Cancel the wire from U3.D1 to Q60.1 . (REWORK) 119.Add TEST_CHIP on TOP/BOTTOM side for test on C-TEST . 91.07.23. -Del R531 and redefine the Q60's related connection . (Modify CKT,BOM and Layout) C C -Add U34,U35(TEST_CHIP) ON TOP/BOTTOM SIDE . (Modify CKT&Layou t) -Change U12.4's connection from LVDS_BLON# to LCD_DIGON . (Modify CK T&Layout) 120.Modify CPUCLK related schematic for quality improved . 91.07.24. 107.Modify HDD related schematic for C-TEST improve . 91.07.23. -Change C201,C197 from 10PF to 5PF_0.25% . (Modify CKT and BOM) -Change JP9.44's connection from +5VS to NC . (Modify CKT&Layout) 121.Add J5 for CMOS reflash used . 91.07.24. 108.Modify ENE CardBus Ctrl IC related schematic for new version phase in prepared . -Add J5 between K to GND . (Modify CKT&Layout) 91.07.23. -Add R568(0ohm) between Q61.3 and Q61.1 . (Modify CKT,BOM and Layout) 122.Del the net 1394_PME# because the function disable . 91.07.24. -Change R538 from 100Kohm to @100Kohm . (Modify CKT&BOM) -Del the signal net 1394_PME# from U2.37 . (Modify CKT&Layou t) -Change Q61 from 2N7002 to @2N7002 . (Modify CK T&BOM) 123.Modify ATI NB chip CAL related schematic for ATI recommend . 91.07.25. -Change R539 from 10Kohm to @10Kohm . (Modify CKT&BOM) -Add C539,C540(0.01UF) from U3.A16 and U3.B16 to GND . (Modify CKT, BOM and Layout) 109.Modify CPUCLK related CAP value for quality improved . 91.07.23. 124.Modify FERR related resistor's value . 91.07.25. -Change C201,C197 from 5PF_0.25% to 10PF . (Modify CKT& BOM) -Change R530 from 33ohm to 75ohm . (Modify CKT and BOM ) 110.Modify SDCLK_NB_EXT damping resistor's value for quality improved . 91.07.23. 125.Modify PWRGD related schematic to make time delay meet spec. . 91.07.25. B B -Change R282 from 51ohm to 39ohm . (Modify CKT& BOM) -Modify Q20 and Q39 related connection . (Mod ify CKT and Layout) 111.Del REFCLK0_AC97 related signal net on M/B for EMI request . 91.07.23. -Del R570(47ohm_0603),R347(10Kohm),Q37(DTC124EK) . (Modify CKT,BOM and Layout) -Del R278(@22ohm) and C181(@10PF) . (Modify CKT&Laout ) 126.Add some CAP for SB quality . 91.07.25. -Del REFCLK0_AC97 related signal net on M/B . (Modify CKT and Layout) -Add C541,C542,C543,C544(0.1UF) between +3VS and GND . (Mo dify CKT,BOM and Layout) 112.Modify modem related schematic for EMI request . 91.07.23. -Add C545,C546(0.1UF) between +5VS and GND . (Mo dify CKT,BOM and Layout) -Change C445,C449 from 220PF_3KV_1808 to @220PF_3KV_1808 . (Modify CKT and BOM ) 127.Add ADP_I related schematic for Power team request . 91.07.25. 113.Modify +RTCVCC related schematic to fix the power source issue . 91.07.23. -Add ADP_I related signal net on M/B . (Modify CKT a nd Layout) -Add D39(RB751V) between U12.161 and K . (Modi fy CKT,BOM and Layout) -Add R233(2Mohm_0603) and C169(0.22UF_0603) . (Modify CKT and La yout) -Change R345 from 0ohm_0603 to @0ohm_0603 . (Modify CKT and BO M) 128.Del CPU socket related test point related to avoid power noise coupling . 91.07.26. 114.Modify ADP_I related schematic for clear . 91.07.23. -Del TP6,TP7,TP8 . (Modify CKT&Layout) -Del ADP_I related signal net on M/B . (Modify CKT and Layout) 129.Modify MVREF_DIM2 related resistors' size for layout space . 91.07.26. -Del R233(@2Mohm_0603) and C169(@0.22UF_0603) . (Modify CKT and Lay out) -Change R464,R466 from @1K_1%_0603 to @1K_1% . (Modify CKT, BOM and Layout) A A -Change R465 from 0ohm_0603 to 0ohm . (Modify CKT,BOM and La yout) Compal Electronics, Inc. Title THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL H/W2 EE Dept. PIR SHEET(5) AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D Size Document Number Rev DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS,INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS MAY BE 0.4 LA-1481 M/B USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS,INC. Date: fff, kQkQ 14, 2002 Sheet 46 of 47 5 4 3 2 1 5 4 3 2 1 BFY26 B-TEST Modify > 130.Modify SADDINCLK# related schematic for Jason request . 91.07.29. 144.Modify +RTCVCC related schematic for clear . 91.08.11. -Change L20,L21 from NL252018T-010J to 0ohm_0805 . (Modify CKT and BOM) -Change Q15 from MMBT3906 to @MMBT3906 . (Modify CKT and BOM) 131.Modify NB Clock Termination related schematic to meet chip loading timing with CPU . -Change Q16 from 3904 to @3904 . (Modif y CKT and BOM) 91.07.29. D -Change D38 from @RB751V to RB751V . (Modify CKT and BO M) D -Change R401,R402,R411,R407 from 10ohm to @10ohm . (Modify CKT and BO M) -Change R158,R162 from 10K to @10K . (Modify CKT a nd BOM) 132.Modify Power Good related schematic to meet timing request . 91.07.30. -Change R156 from 51K to @51K . (Modify CKT and BOM) -Change R216's connection from +2.5V to +2.5VS . (Mo dify CKT&Layout) 145.Modify DDR related schematic for quality improved . 91.08.12. -Change R216 from 4.7Kohm to 1Kohm . (Modify CKT&BOM) -Change R279,R285,R464 from @1K_1% to 1K_1% . (Modify CK T and BOM) -Add R579(47Kohm) between NB_PWRGD and GND . (Modify CK T,BOM and Layout) -Change R280,R533 from 0ohm_0603 to @0ohm_0603 . (Modify CKT and BO M) -Add R578(10Kohm) between PWRGD and GND . (Modify CKT,BOM and Layout) -Change R465 from 0ohm to @0ohm . (Modify CKT and B OM) 133.Modify SB related schematic for power source . 91.07.30. -Change R466 from @1Kohm_1% to 866ohm_1% . (Modify CKT and B OM) -Change U5.5s connection from +3VS to +3VALW . (Mod ify CKT&Layout) -Change R534 from @1Kohm_1%_0603 to 866ohm_1%_0603 . (Modify CKT and B OM) C-TEST BOM EN1 RELEASE -Change R532 from @1K_1%_0603 to 1K_1%_0603 . (Modify CK T and BOM) 134.Modify Power Good related schematic to meet timing request . 91.07.30. -Change C235,C236,C237,C238,C239,C240,C245,C246,C247,C248,C258,C259,C260,C261,C262, -Del R224(20Kohm_0603) and R225(10Kohm_0603) . (Modify CKT,BOM and Layout) C263,C264,C265,C266,C267,C268,C269,C270 from 47PF to @47PF . (Modify CKT and BOM) 135.Modify EC_PCLK by-pass CAP. related for PCICLK timing delay . 91.08.09. C C 146.Modify ENE CB1420 related schematic for ENE recommend . 91.08.12. -Change C208 from @10PF to 27PF . (Modify CKT a nd BOM) -Change R479,R480,R485,R489 from 22Kohm to @22Kohm . (Modify CKT and BOM) 136.Add PCIRST# by-pass CAP. . 91.08.09. -Add C547(100PF) between PCIRST# and GND . (Modify CKT,BOM and Layout) 137.Correct Q63(2N7002)'s connection . 91.08.09. -Change Q63.1's connection from GND to R569.2 . (M odify CKT&Layout) -Change Q63.3's connection from R569.2 to GND . (M odify CKT&Layout) 138.Del the net 1394_PME# for schematic clear . 91.08.09. -Del the net 1394_PME# . (Modify CKT&Layou t) 139.Modify +2.5_A's by-pass CAP. for material saving . 91.08.09. -Change C152 from 4.7UF_10V_0805 to @4.7UF_10V_0805 . (Modify CKT an d BOM) 140.Modify LED_YELP and LED1_GRNP's resistor value for SED request . 91.08.09. -Change R518,R492 from 200ohm_0603 to 560ohm_0603 . (Modify CKT and BOM) B B
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Dobre pomysły nie mają przeszłości, mają tylko przyszłość. Robert Mallet De minimis - o najmniejszych rzeczach. Dobroć jest ważniejsza niż mądrość, a uznanie tej prawdy to pierwszy krok do mądrości. Theodore Isaac Rubin Dobro to tylko to, co szlachetne, zło to tylko to, co haniebne. Dla człowieka nie tylko świat otaczający jest zagadką; jest on nią sam dla siebie. I z obu tajemnic bardziej dręczącą wydaje się ta druga. Antoni Kępiński (1918-1972)
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